Tescan CLARA
Tescan TEM AutoPrep™ provides automated lift-out, thinning, and polishing workflows for reproducible TEM lamella preparation. In this workflow, it was used to prepare site-specific silicon lamella below 50 nm with accurate [110] orientation for atomic-resolution imaging.
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Automated lamella preparation: Reduces operator dependence and improves reproducibility
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Site-specific lift-out: Ensures correct region and orientation are selected for TEM studies
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Low-kV final polishing: Minimizes amorphous damage and curtaining artifacts
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Workflow integration: Delivers TEM-ready samples directly within the FIB-SEM





