Streamline Large-Area 2D and 3D Characterizatio
Analyze broad regions quickly and cleanly using high-current Xe plasma FIB with precision polishing, even on challenging materials.
Tescan AMBER X 2 FIB-SEM for Fast, Flexible 2D and 3D Materials Characterization
Tescan AMBER X 2 is designed to keep pace with the realities of modern materials research. Whether you’re characterizing large volumes, fragile interfaces, or beam-sensitive structures, AMBER X 2 enables you to go further, faster, and with precision that scales across sample types.
Built around the high-performance Mistral™ plasma FIB and BrightBeam™ field-free SEM, this platform delivers high-resolution insights at every step of your workflow.
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- Multimodal 2D/3D analysis across a wide array of materials, from metals, ceramics, and polymers to energy-related and other advanced systems
- Artifact-free cross-sectioning with high beam currents and optimized beam profiles
- Concurrent acquisition of EDS, EBSD, and ToF-SIMS data during 3D tomography for combined structural, chemical, and isotopic information
FOR BATTERY RESEARCH APPLICATIONS
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CLARA in Post-Cycling Battery Failure Analysis
Direct nanoscale insights into degradation pathways
- Image cracks, voids, and delamination in cycled electrodes with ultra-high-resolution SEM at low landing energies
- Differentiate binder distribution and particle detachment using energy- and angle-filtered BSE detection
- Identify lithium deposits and SEI breakdown linked to capacity fade and safety risks
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CLARA in Solid Electrolyte and SEI Research
Preserve beam- and air-sensitive interfaces without damage
- Use MultiVac™ variable pressure mode and cryo workflows to stabilize lithium, polymers, and solid electrolytes during imaging
- Resolve SEI thickness and uniformity at sub-nanometer resolution with BrightBeam™ low-keV imaging
- Visualize interfacial chemistry and morphology with stable contrast free of charging artifacts
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CLARA in Electrode and Separator Quality Control
Automated, repeatable analysis for manufacturing and R&D
- Standardize electrode inspections with Essence™ Image Snapper and VisualCoder scripting
- Detect microstructural defects, contamination, and non-uniform binder distribution across large areas
- Correlate SEM imaging with ONCam optical navigation for fast targeting of regions of interest
Essence™ 3D FIB-SEM Multimodal Tomography
This module synchronizes SEM, EDS, EBSD, and ToF-SIMS into a single acquisition routine, making full-volume, multi-channel analysis easier and more consistent.
TESCAN AutoSection™
Automate cross-sectioning workflows with precise control over milling depth, geometry, and sequence. Ideal for routine or multi-sample throughput.
Essence™ Low-Angle Polishing
Preserve structural integrity while polishing samples with fine features or sensitive interfaces. Designed to reduce curtaining and improve surface flatness for EBSD and STEM.
Each software module is fully integrated into the Essence™ environment, ensuring a smooth learning curve and reproducibility across users and applications.
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"Tescan AMBER X 2, our latest innovation in materials analysis technology. The AMBER X 2, with its advanced Plasma FIB-SEM capabilities, offers unmatched speed, precision, and versatility, setting a new standard in the field."
PETR KLIMEK
PRODUCT MARKETING DIRECTOR
MATERIAL & GEO SCIENCE
TESCAN
PRODUCT MARKETING DIRECTOR
MATERIAL & GEO SCIENCE
TESCAN
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Output Exmples
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Specifications for Battery Research
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