Field-free ultra-high-resolution imaging
BrightBeam™ delivers ultra-high resolution at low keV, while beam deceleration further improves resolution and signal quality
Tescan CLARA for materials science provides the widest selection of contrast methods for advanced surface characterization. It reveals fine details and hidden features across all material types, including nanomaterials, metals, and energy storage components.
Field-free ultra-high-resolution imaging
BrightBeam™ delivers ultra-high resolution at low keV, while beam deceleration further improves resolution and signal quality
Comprehensive contrast selection
Axial and MD In-Column detectors provide angular and energy-filtered contrasts, revealing hidden structures on complex surfaces.
Fast, reproducible results
In-Flight Beam Tracing™ and automated alignments enable users to optimize imaging and analysis quickly and consistently.
Seamless navigation
Wide Field Optics™ allows distortion-free navigation from 1× overview down to nanoscale features.
All-in-one analysis
A large chamber accommodates EBSD, EDS, Raman, and in-situ accessories for chemical, structural, and mechanical studies in a single tool.
Automation-ready workflows
VisualCoder and EM Expert PI provide both scripted and no-code automation options for routine tasks and custom experiments.
BrightBeam™ optics with the Axial detector provide surface-sensitive imaging of nanofibers, capturing fine topographic details that affect performance.
Energy-filtered BSE imaging uncovers hidden features in battery electrodes, from binder adhesion on cathodes to structural changes during cycling.
Non-conductive and beam-sensitive materials like mesoporous silica can be imaged without coating, linking nanoscale pore structures to bulk behavior.
Wide Field Optics™ simplifies fracture analysis, while EBSD and EDS mapping reveal phase structures, grain orientation, and material defects.
Integrated stages allow observation of heat- or stress-induced changes, exposing crack propagation and phase transformations directly inside the SEM.
Integrated Raman mapping distinguishes subtle phase differences, and combined with SEM imaging, provides a complete view of material structure and performance.
Essence™ is the central control environment for CLARA, integrating imaging, navigation, and analysis tools.
Customizable multi-user interface with task-focused layouts
Live 3D collision model for safe stage movements
Automated beam alignment and autofocus routines
Integrated workflows for imaging and analytical techniques
Tescan VISUALCODER AND SEM EXPERT PI AUTOMATION FOR EASY WORKFLOW SCRIPTING
VisualCoder and SEM Expert PI allow any user to create scripts for automating repetitive analytical workflows.
No-code workflow builder for routine or repetitive tasks
Python scripting for custom imaging and milling strategies
Combine SEM and FIB operations into single automated recipes
Share scripts and libraries across the research community
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Electronoptics & imaging
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BrightBeam™ FE-SEM column with beam deceleration |
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Axial and MD In-Column detectors |
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Resolution: 0.8 nm @ 30 keV (STEM), 0.9 nm @ 15 keV, 1.3 nm @ 1 keV, 1.2 nm with beam deceleration, 1.5 nm @ 500 eV |
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Magnification: 1× to 2,000,000× |
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High-speed beam blanker |
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Vacuum system
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High vacuum mode |
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MultiVac™ low vacuum mode including N2 and H2O up to 500 Pa |
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Automated aperture insertion |
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Stage & chamber
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5-axis motorized stage |
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Max sample size: 335 × 280 × 133 mm |
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Max load: up to 8 kg |
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20 chamber ports for detector integration |
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Navigation & protection
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Wide Field Optics™ (navigation from 1×) |
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Essence™ 3D Collision Model |
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Software & automation
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Tescan Essence™ interface with multi-user support |
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Automated beam alignment and In-FlightBeam Tracing™ |
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VisualCoder™ no-code automation* |
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SEM Expert PI Python interface* |
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Raman, tensile, and heating stage integration* |
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*Optional features are available |
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Electronoptics & imaging
|
|---|
|
BrightBeam™ FE-SEM column with beam deceleration |
|
Axial and MD In-Column detectors |
|
Resolution: 0.8 nm @ 30 keV (STEM), 0.9 nm @ 15 keV, 1.3 nm @ 1 keV, 1.2 nm with beam deceleration, 1.5 nm @ 500 eV |
|
Magnification: 1× to 2,000,000× |
|
High-speed beam blanker |
|
Vacuum system
|
|---|
|
High vacuum mode |
|
MultiVac™ low vacuum mode including N2 and H2O up to 500 Pa |
|
Automated aperture insertion |
|
Stage & chamber
|
|---|
|
5-axis motorized stage |
|
Max sample size: 335 × 280 × 133 mm |
|
Max load: up to 8 kg |
|
20 chamber ports for detector integration |
|
Navigation & protection
|
|---|
|
Wide Field Optics™ (navigation from 1×) |
|
Essence™ 3D Collision Model |
|
Software & automation
|
|---|
|
Tescan Essence™ interface with multi-user support |
|
Automated beam alignment and In-FlightBeam Tracing™ |
|
VisualCoder™ no-code automation* |
|
SEM Expert PI Python interface* |
|
Raman, tensile, and heating stage integration* |
|
*Optional features are available |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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