WEBINAR | Dynamic-to-Detail Micro-CT in One Workflow: UniTOM HR 2

Tescan MAGNA UHR SEM for Nanoscale Materials Characterization

Amber X 2 hero image
Amber X 2 hero image

Tescan MAGNA is designed for researchers pushing the boundaries of materials science. Whether it’s imaging delicate porous frameworks, analyzing nanoparticle dispersions, or resolving complex nanostructures, MAGNA delivers clarity and precision at the sub-nanometer scale.

The Triglav™ SEM column provides ultra-high-resolution imaging across the full voltage range, while the optional Beam Deceleration Technology enhances resolution at low accelerating voltages. MAGNA also supports both conventional SEM and STEM imaging modes. This allows researchers to study surface morphology and internal nanostructures within one instrument. 

  • High-contrast nanoparticle imaging with TriSE™ and TriBE™ detection settings

  • In-Flight Beam Tracing™ for effortless, repeatable imaging and rapid condition switching

  • Safe, multi-user operation enabled by Essence™ software and live 3D collision modeling

Main Benefits of Tescan MAGNA

for Nanoscale Materials Characterization

Sub-nanometer Resolution Across All Voltages

The Triglav™ SEM column delivers crisp, ultrahigh resolution imaging down to 0.5nm at 30 keV, ensuring accuratevisualization of even the finest nanostructures.

Flexible SEM and STEM Imaging in One Platform

Observe surface topography and internal features withSEM and STEM, enabling comprehensive characterization of nanoparticles,nanotubes, and porous frameworks.

High-Contrast Detection for Complex Materials

The TriSE ™ and TriBE ™ detection system provides selective energy andangular filtering, revealing structural and compositional details in blacksilicon, catalytic materials, and other challenging samples.

Effortless Imaging Setup and Switching

With In-FlightBeam Tracing™ and automated beam alignment, researchers can rapidly establishoptimal conditions and transition between imaging and analytical modes withoutworkflow interruptions.

Safe, Multi-User SEM Operation

Essence™software with a live 3D collision model ensures straightforwardoperation, making MAGNA ideal for shared laboratory environments with users ofvarying expertise.

Automation and Scripting for Advanced Workflows

Use VisualCoderSEM automation or the FIB-SEM Expert PI to standardize workflows, automaterepetitive tasks, and integrate statistical particle analysis for reproducible,high-throughput research.

Software Overview

Essence™ SEM Control with Live 3D Collision Model

Operate confidently in multi-user environments. The integrated 3D collision model protects samples and detectors, ensuring safe navigation even during complex imaging tasks.

In-Flight Beam Tracing™

Achieve optimal beam alignment and imaging conditions instantly. Automated routines deliver repeatable, high-resolution performance without extensive manual fine-tuning.

VisualCoder SEM Automation

Create custom imaging and analysis workflows using a no-code builder. Standardize experiments, automate repetitive tasks, and extend functionality across research teams.

SEM Expert PI – Python Scripting API

Leverage advanced scripting for precise control of SEM functions. Automate data acquisition and tailor nanoscale analysis to specific research needs.

Each software feature is seamlessly integrated within the Essence™ platform, combining ease of use with advanced automation to support both novice and expert operators.

Unlocked content

Why Choose Tescan MAGNA

for Nanoscale Materials Characterization?

Unlock 
tescan insight

leave a contact to access

Get the most out of Tescan

This is more than information; it's an advantage. We've compiled our technical whitepapers, detailed product flyers, and on-demand webinars to provide you with the knowledge that makes a real difference. Sign up now to access the insights you need to make an impact.

TESCAN MAGNA for Materials Science

Technical specification
Tescan MAGNA

Electron source: High-brightness Schottky field electron emitter

Resolution: 0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV, 0.9 nm at 1 keV (BDT*)

Electron beam landing energy: 200 eV – 30 keV (<50 eV with BDT*)

Magnification range: Up to 2,000,000×

Standard detectors and accessories: In-Beam SE, In-Beam BSE (energy-filtered), SE, IR camera, Integrated plasma cleaner

Optional detectors and accessories: Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd-party detectors and analyzers, Electrostatic Beam Blanker

Analytical integration: Compatible with 3rd-party EDS, EBSD, WDS

Stage movement: Motorized 5-axis stage (X, Y, Z, R, T)

Chamber: Large analytical chamber supporting multiple detectors and accessories

Vacuum modes: High-vacuum mode, MultiVac™ (N₂ or H₂O)

Automation: SEM Expert PI and VisualCoder for workflow automation; Essence™ Image Snapper for batch imaging and panorama creation

User interface: Essence™ GUI with intuitive control environment and live 3D collision model

System options: Beam Deceleration Technology (BDT), ONCam, Load locks, Electron Beam Lithography, etc.

Tescan MAGNA

Electron source: High-brightness Schottky field electron emitter

Resolution: 0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV, 0.9 nm at 1 keV (BDT*)

Electron beam landing energy: 200 eV – 30 keV (<50 eV with BDT*)

Magnification range: Up to 2,000,000×

Standard detectors and accessories: In-Beam SE, In-Beam BSE (energy-filtered), SE, IR camera, Integrated plasma cleaner

Optional detectors and accessories: Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd-party detectors and analyzers, Electrostatic Beam Blanker

Analytical integration: Compatible with 3rd-party EDS, EBSD, WDS

Stage movement: Motorized 5-axis stage (X, Y, Z, R, T)

Chamber: Large analytical chamber supporting multiple detectors and accessories

Vacuum modes: High-vacuum mode, MultiVac™ (N₂ or H₂O)

Automation: SEM Expert PI and VisualCoder for workflow automation; Essence™ Image Snapper for batch imaging and panorama creation

User interface: Essence™ GUI with intuitive control environment and live 3D collision model

System options: Beam Deceleration Technology (BDT), ONCam, Load locks, Electron Beam Lithography, etc.

AMBER-X2

GET IN Touch

Contact us

map

Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

No distributors found.