Sub-nanometer Resolution Across All Voltages
The Triglav™ SEM column delivers crisp, ultrahigh resolution imaging down to 0.5nm at 30 keV, ensuring accuratevisualization of even the finest nanostructures.
Tescan MAGNA is designed for researchers pushing the boundaries of materials science. Whether it’s imaging delicate porous frameworks, analyzing nanoparticle dispersions, or resolving complex nanostructures, MAGNA delivers clarity and precision at the sub-nanometer scale.
The Triglav™ SEM column provides ultra-high-resolution imaging across the full voltage range, while the optional Beam Deceleration Technology enhances resolution at low accelerating voltages. MAGNA also supports both conventional SEM and STEM imaging modes. This allows researchers to study surface morphology and internal nanostructures within one instrument.
Sub-nanometer Resolution Across All Voltages
The Triglav™ SEM column delivers crisp, ultrahigh resolution imaging down to 0.5nm at 30 keV, ensuring accuratevisualization of even the finest nanostructures.
Flexible SEM and STEM Imaging in One Platform
Observe surface topography and internal features withSEM and STEM, enabling comprehensive characterization of nanoparticles,nanotubes, and porous frameworks.
High-Contrast Detection for Complex Materials
The TriSE ™ and TriBE ™ detection system provides selective energy andangular filtering, revealing structural and compositional details in blacksilicon, catalytic materials, and other challenging samples.
Effortless Imaging Setup and Switching
With In-FlightBeam Tracing™ and automated beam alignment, researchers can rapidly establishoptimal conditions and transition between imaging and analytical modes withoutworkflow interruptions.
Safe, Multi-User SEM Operation
Essence™software with a live 3D collision model ensures straightforwardoperation, making MAGNA ideal for shared laboratory environments with users ofvarying expertise.
Automation and Scripting for Advanced Workflows
Use VisualCoderSEM automation or the FIB-SEM Expert PI to standardize workflows, automaterepetitive tasks, and integrate statistical particle analysis for reproducible,high-throughput research.
Essence™ SEM Control with Live 3D Collision Model
Operate confidently in multi-user environments. The integrated 3D collision model protects samples and detectors, ensuring safe navigation even during complex imaging tasks.
In-Flight Beam Tracing™
Achieve optimal beam alignment and imaging conditions instantly. Automated routines deliver repeatable, high-resolution performance without extensive manual fine-tuning.
VisualCoder SEM Automation
Create custom imaging and analysis workflows using a no-code builder. Standardize experiments, automate repetitive tasks, and extend functionality across research teams.
SEM Expert PI – Python Scripting API
Leverage advanced scripting for precise control of SEM functions. Automate data acquisition and tailor nanoscale analysis to specific research needs.
Each software feature is seamlessly integrated within the Essence™ platform, combining ease of use with advanced automation to support both novice and expert operators.
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Tescan MAGNA
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Electron source: High-brightness Schottky field electron emitter |
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Resolution: 0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV, 0.9 nm at 1 keV (BDT*) |
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Electron beam landing energy: 200 eV – 30 keV (<50 eV with BDT*) |
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Magnification range: Up to 2,000,000× |
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Standard detectors and accessories: In-Beam SE, In-Beam BSE (energy-filtered), SE, IR camera, Integrated plasma cleaner |
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Optional detectors and accessories: Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd-party detectors and analyzers, Electrostatic Beam Blanker |
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Analytical integration: Compatible with 3rd-party EDS, EBSD, WDS |
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Stage movement: Motorized 5-axis stage (X, Y, Z, R, T) |
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Chamber: Large analytical chamber supporting multiple detectors and accessories |
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Vacuum modes: High-vacuum mode, MultiVac™ (N₂ or H₂O) |
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Automation: SEM Expert PI and VisualCoder for workflow automation; Essence™ Image Snapper for batch imaging and panorama creation |
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User interface: Essence™ GUI with intuitive control environment and live 3D collision model |
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System options: Beam Deceleration Technology (BDT), ONCam, Load locks, Electron Beam Lithography, etc. |
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Tescan MAGNA
|
|---|
|
Electron source: High-brightness Schottky field electron emitter |
|
Resolution: 0.5 nm at 30 keV (STEM*), 0.6 nm at 15 keV, 0.9 nm at 1 keV (BDT*) |
|
Electron beam landing energy: 200 eV – 30 keV (<50 eV with BDT*) |
|
Magnification range: Up to 2,000,000× |
|
Standard detectors and accessories: In-Beam SE, In-Beam BSE (energy-filtered), SE, IR camera, Integrated plasma cleaner |
|
Optional detectors and accessories: Chamber BSE detectors, HADF R-STEM, CL, GSD, 3rd-party detectors and analyzers, Electrostatic Beam Blanker |
|
Analytical integration: Compatible with 3rd-party EDS, EBSD, WDS |
|
Stage movement: Motorized 5-axis stage (X, Y, Z, R, T) |
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Chamber: Large analytical chamber supporting multiple detectors and accessories |
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Vacuum modes: High-vacuum mode, MultiVac™ (N₂ or H₂O) |
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Automation: SEM Expert PI and VisualCoder for workflow automation; Essence™ Image Snapper for batch imaging and panorama creation |
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User interface: Essence™ GUI with intuitive control environment and live 3D collision model |
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System options: Beam Deceleration Technology (BDT), ONCam, Load locks, Electron Beam Lithography, etc. |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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