Tescan MIRA for Materials Science

Tescan MIRA is an analytical FEG-SEM for high-throughput materials analysis and sub-micron characterization. Its Schottky FEG source, Essence™ EDS, and advanced imaging technologies provide the stability, speed, and contrast needed for structural and compositional studies.

High-resolution SE/BSE imaging with Schottky FEG stability

Wide Field Optics™ for fast navigation from 2× magnification

In-Flight Beam Tracing™ and automated alignment for consistent imaging

Beam Deceleration Technology for improved low-kV surface detail

SingleVac™ and MultiVac for non-conductive materials

Modular chamber with support for EBSD, Raman, CL, and correlative workflows

Workflow automation with VisualCoder and Nanoprototyping Toolbox with Python scripting for fabrication and automation

How Tescan MIRA Enhances SEM Workflows

for Materials Research and Analysis

Integrated Imaging and Elemental Analysis

Switch seamlessly between high-resolution imaging and compositional data with Essence™ EDS. A single live interface reduces workflow steps and accelerates structural and compositional analysis.

Rapid Navigation with Wide Field Optics™

Begin at 2× magnification for immediate context. Wide Field Optics™ enables you to locate regions of interest quickly, supporting efficient work on powders, composites, metals, and other complex materials.

Consistent, Fast Results with In-Flight Beam Tracing™

In-Flight Beam Tracing™ and automated beam alignment ensure stable, optimized imaging conditions. This delivers reliable data, especially valuable for high-throughput materials analysis and failure investigation.

Reliable Imaging of Charging Samples

SingleVac™ and MultiVac modes enable confident imaging of ceramics, glass, polymers, fibers, and other non-conductive materials. Low-vacuum flexibility helps preserve surface detail and minimize artefacts.

Modular Platform for Evolving Research Needs

Expand your workflow with EBSD, Raman, CL, STEM, or WDS as demands grow. Correlative workflows are fully supported, making MIRA a versatile SEM for composite materials and advanced microstructural studies.

High-Resolution Imaging Across Material Types

The Schottky FEG source, optional Beam Deceleration Technology with in-column SE and BSE detectors, provide crisp detail for sub-micron materials characterization. This is ideal for powders, fibers, and fine structures analysis.

Tools for Advanced Development and Prototyping

Use the Nanoprototyping Toolbox and Python scripting to automate tasks, create structures, or support device fabrication—bringing greater flexibility to experimental materials science.

TESCAN ESSENCE™

Unified Control for Imaging, Analysis, and Prototyping

Tescan Essence™ provides a modular software environment for MIRA, integrating imaging, navigation, EDS analysis, nanofabrication tools, and system automation in a single customizable interface. This unified design supports efficient, predictable workflows for both routine and advanced SEM tasks.

Access spectra, maps, and compositional data directly in the SEM window using Essence™ EDS
Maintain stable beam conditions through automated routines and In-Flight Beam Tracing™
Navigate safely with real-time chamber visualization using the Essence™ 3D Collision Model
Create patterns and structures with Essence™ DrawBeam and the Essence™ EBL Kit
Automate complex procedures with no-code automation through VisualCoder and SEM Expert PI integrated Python scripting

Unlocked content

Why Choose Tescan MIRA

for Materials Science?

Get the most out of Tescan

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TESCAN MIRA for Materials Science

Technical specification

Electron Optics & Imaging	High-brightness Schottky FEG electron source
	High-vacuum resolution: <1.2 nm @ 30 keV (SE detector)
	Magnification range: 2× to 1,000,000×
	Optional High-speed beam blanker
	Fracture-free pattern generator with 20 ns dwell time
Vacuum System	High vacuum mode
Vacuum System	SingleVac™ and MultiVac low-vacuum modes (N2, H2O; up to 700 Pa)
Stage & Chamber	5-axis motorized stage
	Maximum sample size (GM chamber): 300 × 300 × 100 mm
	Maximum load capacity: up to 8 kg
	More than 20 chamber ports for detector expansion
Detection	SE and BSE imaging support
	Optional in-column SE/BSE detectors
	Compatibility with EBSD, Raman, CL, STEM, WDS, and other modular detectors
	Integrated Essence™ EDS for SEM–EDS workflows
Navigation & Protection	Wide Field Optics™ enabling SEM navigation from 2× magnification
Navigation & Protection	Essence™ 3D Collision Model for real-time chamber visualization and collision prevention
Software & Automation	Essence™ software interface with customizable layout
	Automated focus and other beam alignment routines
	In-Flight Beam Tracing™ for optimized beam conditions
	Essence™ EBL Kit and Essence™ DrawBeam Automate for patterning workflows
	VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting

Electron Optics & Imaging

High-brightness Schottky FEG electron source

High-vacuum resolution: <1.2 nm @ 30 keV (SE detector)

Magnification range: 2× to 1,000,000×

Optional High-speed beam blanker

Fracture-free pattern generator with 20 ns dwell time

Vacuum System

High vacuum mode

SingleVac™ and MultiVac low-vacuum modes (N2, H2O; up to 700 Pa)

Stage & Chamber

5-axis motorized stage

Maximum sample size (GM chamber): 300 × 300 × 100 mm

Maximum load capacity: up to 8 kg

More than 20 chamber ports for detector expansion

Detection

SE and BSE imaging support

Optional in-column SE/BSE detectors

Compatibility with EBSD, Raman, CL, STEM, WDS, and other modular detectors

Integrated Essence™ EDS for SEM–EDS workflows

Navigation & Protection

Wide Field Optics™ enabling SEM navigation from 2× magnification

Essence™ 3D Collision Model for real-time chamber visualization and collision prevention

Software & Automation

Essence™ software interface with customizable layout

Automated focus and other beam alignment routines

In-Flight Beam Tracing™ for optimized beam conditions

Essence™ EBL Kit and Essence™ DrawBeam Automate for patterning workflows

VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting

GET IN Touch

Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

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