Reproducible High-Resolution Imaging
BrightBeam™ technology ensures nanometer-scale resolution with consistent, repeatable imaging across diverse materials.
Tescan MIRA XR is built for modern materials science, combining reproducible ultra-high-resolution imaging with rapid, precise EDS analysis. It streamlines workflows in research and quality control, reducing dependency on operator expertise while ensuring consistent results.
Reproducible High-Resolution Imaging
BrightBeam™ technology ensures nanometer-scale resolution with consistent, repeatable imaging across diverse materials.
Fast, Accurate Chemical Analysis
Dual Essence™ EDS enables rapid multi-element mapping with reduced shading, doubling throughput for compositional studies.
Effortless Navigation Across Scales
Wide Field Optics™ and In-Flight Beam TracingTM allows smooth transitions from millimeter-scale overviews to nanoscale details, cutting time-to-data by up to 30% and providing best imaging conditions for each analysis.
Confident Imaging of Challenging Samples
MultiVac low-vacuum mode supports reliable imaging of charging, , or beam-sensitive materials without surface coating.
Automation for Every User
VisualCoder workflow builders allow anyone to create automated routines that reduce operator workload by up to 80%, making SEM operation accessible and repeatable for all users.
Crystallography Workflows
Optional large-area EBSD mapping provides crystallographic data from regions larger than 5 millimeters down to the nanoscale.
Essence™ Interface for MIRA XR
Essence™ is the central control environment for MIRA XR, integrating imaging, navigation, and analysis tools.
Customizable multi-user interface with task-focused layouts
Live 3D collision model for safe stage movements
Automated beam alignment and autofocus routines
Integrated workflows for imaging and analytical techniques
VisualCoder Workflow Automation
Drag-and-drop workflow builder that allows users to automate repetitive imaging and analytical tasks. Reduces operator workload by up to 80% and guarantees consistent data quality in multi-user environments.
SEM Expert PI
Advanced programming interface that enables labs to design and deploy custom SEM workflows. Ideal for specialized research or high-throughput analytical routines requiring tailored automation.
Essence™ 3D Collision Model
Live chamber visualization with collision protection. Provides real-time positioning feedback, safeguarding detectors and samples during complex stage movements and multi-detector configurations.
Imaging and EDS Routines
Integrated autofocus, beam alignment, and EDS acquisition with Dual Essence™ detectors. Accelerates analytical workflow and ensures shading-free data collection for precise material characterization.
All modules are seamlessly integrated into the Essence™ software environment, delivering consistent, efficient, and reproducible results across a wide range of materials science workflows.
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TESCAN MIRA XR® UHR SEM-EDS for Materials Science
Specifications shown are based on the GM chamber configuration. |
Ultra-high resolution BrightBeam™ FE-SEM column |
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Resolution: |
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Magnification range from 1× to 2,000,000× |
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Essence™ integration for SEM and EDS in one interface |
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Elemental mapping, line scans, and point analysis included |
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Wide Field Optics™ for SEM navigation from 1× |
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Essence™ 3D Collision Model for chamber visualization and protection |
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MultiVac low vacuum imaging up to 500 Pa |
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5-axis motorized stage with max sample size of 335 × 280 × 133 mm³ and load capacity up to 8 kg |
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20+ chamber ports ready for detector upgrades |
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Included & Optional Accessories
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Dual Essence™ EDS detectors for high-speed mapping |
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In-Column Axial detector for high-efficiency ultra-high resolution imaging |
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EBSD detector for crystallographic analysis from large maps to nanoscale |
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STEM detector for transmission imaging at sub-nanometer resolution |
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VisualCoder™ and SEM Expert PI for workflow automation and customization |
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VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting |
|
TESCAN MIRA XR® UHR SEM-EDS for Materials Science
Specifications shown are based on the GM chamber configuration. |
|---|
|
Ultra-high resolution BrightBeam™ FE-SEM column |
|
Resolution: |
|
Magnification range from 1× to 2,000,000× |
|
Essence™ integration for SEM and EDS in one interface |
|
Elemental mapping, line scans, and point analysis included |
|
Wide Field Optics™ for SEM navigation from 1× |
|
Essence™ 3D Collision Model for chamber visualization and protection |
|
MultiVac low vacuum imaging up to 500 Pa |
|
5-axis motorized stage with max sample size of 335 × 280 × 133 mm³ and load capacity up to 8 kg |
|
20+ chamber ports ready for detector upgrades |
|
Included & Optional Accessories
|
|---|
|
Dual Essence™ EDS detectors for high-speed mapping |
|
In-Column Axial detector for high-efficiency ultra-high resolution imaging |
|
EBSD detector for crystallographic analysis from large maps to nanoscale |
|
STEM detector for transmission imaging at sub-nanometer resolution |
|
VisualCoder™ and SEM Expert PI for workflow automation and customization |
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VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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