Achieve Consistent, High-Quality TEM Sample Preparation with Tescan FIB-SEM Workflows 

The Limitations of Conventional TEM Sample Prep

Conventional FIB workflows make TEM sample preparation slow, variable, and highly dependent on operator skill. Achieving lamella thinner than 50 nm is difficult, and poor orientation control often prevents accurate visualization of nanoscale defects. As a result, essential structural information can be lost, limiting the reliability of TEM analysis.

Tescan FIB-SEM with TEM AutoPrep™ solves these challenges by automating lift-out, thinning, and polishing in one reproducible workflow.

• Prepare lamella consistently below 50 nm
• Ensure accurate site-specific orientation
• Reduce operator dependence through automation
• Minimize preparation time without sacrificing quality
• Validate specimen quality in-situ with integrated STEM imaging

Achieve reproducible TEM results by overcoming the variability of traditional methods and preparing reliable, high-quality lamella for atomic-scale imaging.

How TEM Sample Preparation Was Performed Using Tescan FIB-SEM with TEM AutoPrep™

A silicon (Si) wafer was selected to demonstrate automated TEM lamella preparation from a single-crystal material. Using Tescan’s FIB-SEM with TEM AutoPrep™, multiple site-specific trenches were milled, and arrays of lamella were automatically prepared in a controlled sequence.

After lift-out, lamella were precisely aligned to the [110] orientation to visualize the Si dumbbell structure. Automated thinning reduced each specimen to below 50 nm, while low-kV polishing minimized amorphous damage and curtaining artifacts.

Quality was validated in-situ using integrated HAADF STEM imaging, confirming correct thickness and orientation before TEM transfer. This automated workflow ensured reproducible, ultra-thin lamella preparation suitable for atomic-resolution crystallographic analysis.

Automated TEM Lamella Preparation Validated Through Atomic-Scale Imaging

Tescan FIB-SEM with TEM AutoPrep™ produced multiple silicon lamella with uniform thickness below 50 nm. Automated alignment to the [110] orientation provided the correct geometry for atomic-resolution imaging and eliminated variability common in manual workflows.

HAADF STEM imaging confirmed clear visualization of the silicon dumbbell structure, a direct indicator of lamella quality and orientation accuracy. The results demonstrate that automated preparation consistently delivers specimens suitable for detailed crystallographic and defect studies.

This workflow integrates lift-out, thinning, polishing, and validation into a single automated process, ensuring reproducible results with fewer artifacts and significantly less operator dependence.