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Tescan VEGA for Materials Science

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Tescan VEGA is a tungsten-based SEM built for routine imaging, analysis, and quality control. By combining dependable electron optics with fully integrated Essence™ EDS, it delivers both high-resolution images and live elemental data in a single workflow. With Wide Field Optics™ and In-Flight Beam Tracing™, VEGA provides reliable performance across materials science applications.

  • High-resolution SEM imaging with 3 nm resolution at 30 keV

  • SEM and EDS analysis together in Essence™ software

  • Flexible vacuum modes for conductive and non-conductive samples

  • Wide Field Optics™ for navigation from 2× magnification

WHERE Tescan VEGA MAKES THE DIFFERENCE

Integrated imaging and analysis

Switch between imaging and live EDS spectra or maps in one software window.

Navigation without limits

Survey large or irregular samples from 2× magnification using Wide Field Mode™.

Reliable results across sample types

SingleVac™ and optional MultiVac support conductive, non-conductive, and beam-sensitive materials without coating.

Safe and intuitive operation

Essence™ 3D Collision Model protects samples and detectors during stage movement.

Designed for productivity

Automated alignment and autofocus routines to shorten training time and speed up routine work.

Scalable platform

More than 20 chamber ports and a range of detectors let VEGA grow with your lab.

Tescan ESSENCE™

UNIFIED CONTROL FOR IMAGING AND ANALYSIS

Essence™ is the unified control environment for VEGA. It brings SEM control, live EDS, navigation, and protection tools into a single interface to keep workflows clear and repeatable.

  • Spectra, elemental maps, and imaging data are accessible within a single Essence™ EDS interface

  • In-Flight Beam Tracing™ and recipe-driven automation for consistent results

  • Wide Field Optics™ and the 3D Collision Model for confident navigation and safe operation

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TESCAN VEGA for Materials Science

Technical specification
Electron optics and imaging

Electron source: Tungsten heated cathode

Resolution: 3.0 nm at 30 keV (SE) in high vacuum

Magnification: 2× to 1,000,000×

Elemental analysis

Seamless integration of EDS into Essence™ software

Spectra, elemental maps, and line scans in a single software window

Vacuum system

High vacuum mode

SingleVac™ standard mode for beam sensitive and charging samples

Low vacuum (MultiVac™ option) with GSD detector for imaging without coating

Stage and chamber

5-axis motorized stage (X, Y, Z, rotation, tilt)

X & Y axis travel range: 130 mm × 100 mm

Maximum sample size (GM chamber): up to 180 mm diameter × 92 mm height (larger samples possible with limited stage movement)

Maximum load capacity (GM chamber): up to 8 kg

More than 20 chamber ports for detector or accessory integration

Navigation and protection

Wide Field Optics™ for overview and navigation from 2×

Essence™ 3D Collision Model for safe stage movements

Software and automation

Essence™ interface with multi-user support

Automated alignment and autofocus routines

In-Flight Beam Tracing™ for optimized beam conditions

Electron optics and imaging

Electron source: Tungsten heated cathode

Resolution: 3.0 nm at 30 keV (SE) in high vacuum

Magnification: 2× to 1,000,000×

Elemental analysis

Seamless integration of EDS into Essence™ software

Spectra, elemental maps, and line scans in a single software window

Vacuum system

High vacuum mode

SingleVac™ standard mode for beam sensitive and charging samples

Low vacuum (MultiVac™ option) with GSD detector for imaging without coating

Stage and chamber

5-axis motorized stage (X, Y, Z, rotation, tilt)

X & Y axis travel range: 130 mm × 100 mm

Maximum sample size (GM chamber): up to 180 mm diameter × 92 mm height (larger samples possible with limited stage movement)

Maximum load capacity (GM chamber): up to 8 kg

More than 20 chamber ports for detector or accessory integration

Navigation and protection

Wide Field Optics™ for overview and navigation from 2×

Essence™ 3D Collision Model for safe stage movements

Software and automation

Essence™ interface with multi-user support

Automated alignment and autofocus routines

In-Flight Beam Tracing™ for optimized beam conditions

AMBER-X2

GET IN Touch

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Where can you find us: 

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

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