Integrated imaging and analysis
Switch between imaging and live EDS spectra or maps in one software window.
Tescan VEGA is a tungsten-based SEM built for routine imaging, analysis, and quality control. By combining dependable electron optics with fully integrated Essence™ EDS, it delivers both high-resolution images and live elemental data in a single workflow. With Wide Field Optics™ and In-Flight Beam Tracing™, VEGA provides reliable performance across materials science applications.
Integrated imaging and analysis
Switch between imaging and live EDS spectra or maps in one software window.
Navigation without limits
Survey large or irregular samples from 2× magnification using Wide Field Mode™.
Reliable results across sample types
SingleVac™ and optional MultiVac support conductive, non-conductive, and beam-sensitive materials without coating.
Safe and intuitive operation
Essence™ 3D Collision Model protects samples and detectors during stage movement.
Designed for productivity
Automated alignment and autofocus routines to shorten training time and speed up routine work.
Scalable platform
More than 20 chamber ports and a range of detectors let VEGA grow with your lab.
Examine fracture surfaces, grain boundaries, and inclusions in metals and alloys. VEGA delivers high-contrast SE and BSE imaging with integrated EDS for morphology–composition correlation.
Inspect structure and composition quickly and reproducibly. Wide Field Optics™ enables smooth navigation across full samples and Essence™ EDS provides immediate chemical confirmation.
Analyze grain size, porosity, and phase distribution in alloys and ceramics. BSE imaging with EDS mapping supports process optimization and defect evaluation.
Characterize particle shape, size, and surface features at the micron scale. MultiVac with the GSD detector enhances imaging of uncoated or non-conductive samples including ceramics and AM powders.
Study non-conductive and beam-sensitive materials without coating. SingleVac™ and MultiVac preserve image quality while protecting delicate specimens.
Visualize fiber architecture with BSE, then determine composition with Essence™ EDS to complete the picture.
Essence™ is the unified control environment for VEGA. It brings SEM control, live EDS, navigation, and protection tools into a single interface to keep workflows clear and repeatable.
Spectra, elemental maps, and imaging data are accessible within a single Essence™ EDS interface
In-Flight Beam Tracing™ and recipe-driven automation for consistent results
Wide Field Optics™ and the 3D Collision Model for confident navigation and safe operation
This is more than information; it's an advantage. We've compiled our technical whitepapers, detailed product flyers, and on-demand webinars to provide you with the knowledge that makes a real difference. Sign up now to access the insights you need to make an impact.
|
Electron optics and imaging
|
Electron source: Tungsten heated cathode |
|---|---|
|
Resolution: 3.0 nm at 30 keV (SE) in high vacuum |
|
|
Magnification: 2× to 1,000,000× |
|
|
Elemental analysis
|
Seamless integration of EDS into Essence™ software |
|
Spectra, elemental maps, and line scans in a single software window |
|
|
Vacuum system
|
High vacuum mode |
|
SingleVac™ standard mode for beam sensitive and charging samples |
|
|
Low vacuum (MultiVac™ option) with GSD detector for imaging without coating |
|
|
Stage and chamber
|
5-axis motorized stage (X, Y, Z, rotation, tilt) |
|
X & Y axis travel range: 130 mm × 100 mm |
|
|
Maximum sample size (GM chamber): up to 180 mm diameter × 92 mm height (larger samples possible with limited stage movement) |
|
|
Maximum load capacity (GM chamber): up to 8 kg |
|
|
More than 20 chamber ports for detector or accessory integration |
|
|
Navigation and protection
|
Wide Field Optics™ for overview and navigation from 2× |
|
Essence™ 3D Collision Model for safe stage movements |
|
|
Software and automation
|
Essence™ interface with multi-user support |
|
Automated alignment and autofocus routines |
|
|
In-Flight Beam Tracing™ for optimized beam conditions |
|
Electron optics and imaging
|
|---|
|
Electron source: Tungsten heated cathode |
|
Resolution: 3.0 nm at 30 keV (SE) in high vacuum |
|
Magnification: 2× to 1,000,000× |
|
Elemental analysis
|
|---|
|
Seamless integration of EDS into Essence™ software |
|
Spectra, elemental maps, and line scans in a single software window |
|
Vacuum system
|
|---|
|
High vacuum mode |
|
SingleVac™ standard mode for beam sensitive and charging samples |
|
Low vacuum (MultiVac™ option) with GSD detector for imaging without coating |
|
Stage and chamber
|
|---|
|
5-axis motorized stage (X, Y, Z, rotation, tilt) |
|
X & Y axis travel range: 130 mm × 100 mm |
|
Maximum sample size (GM chamber): up to 180 mm diameter × 92 mm height (larger samples possible with limited stage movement) |
|
Maximum load capacity (GM chamber): up to 8 kg |
|
More than 20 chamber ports for detector or accessory integration |
|
Navigation and protection
|
|---|
|
Wide Field Optics™ for overview and navigation from 2× |
|
Essence™ 3D Collision Model for safe stage movements |
|
Software and automation
|
|---|
|
Essence™ interface with multi-user support |
|
Automated alignment and autofocus routines |
|
In-Flight Beam Tracing™ for optimized beam conditions |
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
No distributors found.