Tescan SOLARIS 2 for Semiconductors

Advance semiconductor TEM workflows with Tescan SOLARIS 2 Ga FIB-SEM. Purpose-built for failure analysis, R&D, and quality control, SOLARIS 2 integrates the Orage™ 2 Ga FIB column, Triglav™ UHR SEM, TEM AutoPrep™ Pro, and OptiLift™ nanomanipulator to deliver precise, fully automated TEM lamella preparation in under one hour.

Prepare ultra-thin lamellae from sub-10 nm nodes with repeatable accuracy

Target single lines in GAA and FinFET devices using UHR immersion lens SEM imaging

Streamline lift-out, transfer, and polishing with integrated OptiLift™ 4-axis nanomanipulator

Perform UHR imaging with in-beam SE and BSE detectors for enhanced surface contrast

Maintain consistent readiness with overnight automated alignments and system checks

HOW Tescan SOLARIS 2 OPTIMIZES TEM SAMPLE PREPARATION FOR SEMICONDUCTORS

Produce Sub-100 nm TEM Lamellae in Under an Hour

Automate the entire workflow, from trenching to lift-out and final polishing, with TEM AutoPrep™ Pro for fast, repeatable results.

Target Critical Device Features with Accuracy

Pinpoint individual transistor lines in GAA and FinFET devices using high-resolution SEM end-pointing.

Simplify Complex Lamella Geometries

Prepare top-down, plane-view, and inverted lamella without the need for extra flipping devices, thanks to the OptiLift™ nanomanipulator in its unique below-FIB position.

Preserve Sample Integrity with Gentle Finishing

Reduce amorphization and curtaining using automated low-keV cleaning and polishing routines for ultra-thin, damage-free lamellae.

Maximize Uptime with Automated Alignments

Keep your system always ready. Overnight column alignment ensures minimal setup and consistent system performance.

Reveal Fine Structures with UHR SEM Imaging

Leverage the Triglav™ SEM column and in-beam SE/BSE detectors for high-contrast visualization and STEM imaging down to 0.5 nm resolution.

Tescan SOLARIS 2

FOR SEMICONDUCTOR RESEARCH APPLICATIONS

Tescan SOLARIS 2 in Semiconductors

SOLARIS 2 enables semiconductor R&D and process engineers to investigate logic, memory, power, and display devices quickly and with precision. Its consistent automation minimizes operator dependency while ensuring reproducible results across even the most complex structures.

Tescan SOLARIS 2 in Failure Analysis

Failure analysis teams benefit from accelerated workflows that integrate sample prep, lift-out, and imaging. SOLARIS 2 enables reliable defect localization in FinFETs, GAA transistors, and 3D NAND structures, minimizing time-to-insight for corrective action.

Tescan SOLARIS 2 in Device Characterization

Device engineers rely on SOLARIS 2 to combine precise TEM lamella preparation with ultra-high-resolution SEM imaging. The platform supports both process validation and the characterization of next-generation device architectures, delivering consistent data that informs confident design and manufacturing decisions.

TEM AUTOPREP™ PRO

AUTOMATION YOU CAN RELY ON

Tescan TEM AutoPrep™ Pro lets you fully automate TEM lamella preparation, covering trenching, lift-out, welding, thinning, and final low-keV cleaning. Everything runs inside the Essence™ GUI, giving you complete control while ensuring consistent, repeatable results.

AI-driven algorithms handle the details, so you don’t waste time on manual corrections. You get cleaner lamellae, fewer curtaining artifacts, and minimal amorphization.

Combined with OptiLift™, TEM AutoPrep™ Pro enables preparation of top-down, plane-view, and inverted lamellae without extra flipping hardware. That means less complexity for you and higher success rates across all your workflows.

Every lamella you prepare is one you can trust. This saves time, boosting throughput, and giving you confidence in the quality of your TEM and STEM investigations.

TESCAN SOLARIS 2 for Semiconductors

Technical specification

SOLARIS 2	Electron column: Triglav™ UHR SEM with immersion optics
	Ion column: Orage™ 2 Ga FIB, 500 eV–30 keV, probe current <1 pA–100 nA, resolution <2.5 nm @ 30 keV
	Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage
	TEM sample preparation: In situ lift-out with OptiLift™ nanomanipulator or ex situ transfer with Tescan EXLO™; full automation with TEM AutoPrep™ Pro; sample thickness below 100 nm
	Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples lamella
	Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV
	Automation: Scheduled electron/ion column alignments for continuous system readiness

SOLARIS 2

Electron column: Triglav™ UHR SEM with immersion optics

Ion column: Orage™ 2 Ga FIB, 500 eV–30 keV, probe current <1 pA–100 nA, resolution <2.5 nm @ 30 keV

Stage: Motorized 5-axis Compucentric Stage with Tescan Rocking Stage

TEM sample preparation: In situ lift-out with OptiLift™ nanomanipulator or ex situ transfer with Tescan EXLO™; full automation with TEM AutoPrep™ Pro; sample thickness below 100 nm

Grid compatibility: NCD slotted grids, EXpressLO PGrids™ (Cu, Ni); for standard and inverted TEM samples lamella

Detectors: In-beam SE and BSE detectors; STEM imaging at 0.5 nm resolution @ 30 keV

Automation: Scheduled electron/ion column alignments for continuous system readiness

GET IN Touch

Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

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Tescan SOLARIS 2 for Semiconductors

HOW Tescan SOLARIS 2 OPTIMIZES TEM SAMPLE PREPARATION FOR SEMICONDUCTORS