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of Tescan instruments
Scanning Electron Microscopes (SEM)
Tescan’s SEM platforms provide high-resolution imaging and surface analysis with exceptional contrast, detail, and ease of use—ideal for materials research, quality control, and analytical applications.
Focused Ion Beam-Scanning Electron Microscopes (FIB-SEM)
Tescan FIB-SEM systems combine fast, precise milling with high-resolution imaging and advanced automation. Choose from Ga or Xe plasma FIB sources to match your needs in sample prep, prototyping, or failure analysis.
Micro-computed tomography (microCT)
Tescan’s X-ray micro-CT systems deliver fast, high-resolution 3D and 4D imaging for non-destructive internal analysis. Dynamic in-situ capabilities and modular designs make them ideal for advanced research across materials, life sciences, and energy storage.
4D STEM
Tescan's TENSOR is the first 4D-STEM platform built for intuitive multimodal nanocharacterization, combining structural, morphological, and chemical insights in every scan. Real-time data processing, automation, and scripting support make it ideal for both routine and advanced research.
Laser solutions
FemtoChisel is the next-generation femtosecond laser solution built specifically for semiconductor sample preparation and failure analysis. For too long, the industry has had to compromise between throughput, precision, and Surface Quality. Now all are delivered on one integrated platform.
Ex Situ Lift-Out Solutions
Tescan EXLO is designed for laboratories where TEM throughput, reproducibility, and cost efficiency matter. By moving specimen lift-out outside the FIB-SEM, EXLO keeps valuable beam time focused on milling, while parallelizing lamella transfer and grid mounting. The result: higher output, lower cost per specimen, and a more efficient workflow.
Decades of Progress, Just Getting Started
Since 1991, Tescan systems have been designed to feel seamless, intuitive, and built for real research. Think of us as reducing the coefficient of friction between question and discovery.
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